厚截面层合板非同步固化的三维有限元分析

张纪奎; 张江; 马志阳; 程小全

厚截面层合板非同步固化的三维有限元分析

北京航空航天大学航空科学与工程学院, 北京 100191

基金项目: 国家自然科学基金青年基金资助项目（50903002）

详细信息

中图分类号: TB330.1
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出版历程
- 收稿日期: 2013-01-05
- 网络出版日期: 2013-11-30

Three-dimensional finite element analysis for non-synchronized cure of thick composite laminates

School of Aeronautic Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100191, China

摘要

摘要: 建立了描述厚截面复合材料固化压实过程的三维有限元模型并进行了模型有效性验证，计算了400层AS4/3501-6层合板在固化过程中的温度场、固化度、粘性、树脂体积含量和厚度压缩率情况.模型计算结果表明：在固化过程中，层合板的中间层会出现高于保温平台约49K的温度峰值；层合板沿厚度方向的温度和固化度的非同步现象明显；层合板的中部存在明显的局部温度过热和快速固化区域，该区域内的树脂粘性变化剧烈、树脂流动时间缩短，阻碍了该区域及层合板下部的多余树脂流入吸胶膜，并最终导致了固化结束后树脂的不均匀分布，靠近吸胶膜的上表面树脂体积含量约为41%，靠近模具的下表面约为46.5%；层合板的最终固化压实率在15.7%左右.
- 复合材料 /
- 厚截面 /
- 温度 /
- 固化度 /
- 粘性 /
- 树脂流动 /
- 有限元模型
Abstract: A three-dimensional finite element model was established and verified for the description of curing process of thick composite laminates. Temperature, degree of cure, viscosity, resin volume fraction and thickness reduction ratio during the curing process were calculated for a 400-ply AS4/3501-6 laminate. Numerical results manifest that the peak temperature which is 49K higher than the dwell temperature appears at the laminate's central ply; the changes of the temperature and degree of cure are not synchronized along the z-direction; the overshoot and quick-curing area is found evidently in the central part of the laminate; the viscosity varies greatly and the curing time is curtailed in this area, which prevent the spare resin in this area and under-part of the laminate flowing into the bleeder; the fact that the non-average distribution of the resin volume in the laminate stems from the existing of this area in the cure cycle, and the resin volume fraction is about 41% in the surface and 46.5% in the bottom which contact with the bleeder and the tool respectively; the approximate value of thickness reduction ratio is 15.7%.
- composites /
- thick section /
- temperature /
- degree of cure /
- viscosity /
- resin flow /
- finite element model

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参考文献(14)

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