形构形微通道流动换热特性的数值分析

徐国强; 王 梦; 吴 宏; 陶 智

形构形微通道流动换热特性的数值分析

北京航空航天大学航空发动机气动热力重点实验室, 北京 100191

基金项目: 国家自然科学基金资助项目(50436010)

详细信息

作者简介:
徐国强(1964-),男,河北承德人,教授,guoqiang_xu@buaa.edu.cn.

中图分类号: V 231.1
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- 被引次数: 4
出版历程
- 收稿日期: 2008-04-01
- 网络出版日期: 2009-03-31

Numerical analysis of flow and heat transfer characteristics of Y-fractal-link micro channel networks

National Key Lab on Air Engine,Beijing University of Aeronautics and Astronautics, Beijing 100191, China

摘要

摘要: 针对矩形芯片提出了Y形构形微通道的芯片内部冷却结构,通过三维数值计算比较了Y形构形微通道与传统直微通道中的流体层流流动和换热特性,并对Y形构形微通道的重要结构参数进行了优化.研究表明:在相同对流换热面积和水利直径的条件下,Y形构形微通道具有比直微通道更高的传热效率和更低的进出口压降,可以满足高热负荷需求.在研究范围内通道级数为3级、分叉角度为60°、分支个数为2时,散热器的综合换热性能最好.以上结论为Y形构形微通道的结构设计提供了重要依据.
- 微通道 /
- 散热器 /
- 构形 /
- 强化换热
Abstract: A new fractal structure, Y-fractal-link micro channel network, was proposed for cooling the inside of cubic chip. Numerical simulations of laminar heat and flow transfer were conducted for both Y-fractal-link micro channel network and straight parallel micro channel network. In addition, the optimization of this new structure was discussed with some important parameters. Results reveal that with the same convective surface area and hydraulic diameter, Y-fractal-link micro channel network could significantly improve the heat transfer performance of the heat sink and decrease the pressure drop through the micro channel, so this new structure will be useful for cooling devices with high thermal load. In the range of study, the best integrative performance of Y-fractal-link micro channel heat sink is obtained when the number of branching levels is 3; the bifurcation angle is 60 and the number of branches at each level is 2. These results are beneficial to the design and improvement of heat sink configuration.
- micro channel /
- heat sink /
- fractal /
- enhancement heat transfer

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参考文献(1)

[1] 张兆光.电子设备冷却设计手册[M].安徽:电子工业部第十四研究所, 1983:149-162 Zhang Zhaoguang. The cooling of electronic equipment design handbook[M]. Anhui:The Fourteen Graduate School of Electronic Industry Department, 1983:149-162(in Chinese) [2] Tuekerman D B,Pease R F W. Higher-performance heat sink for VLSI IEEE Electron Device Lett. :IEEE,1981:126-277 [3] Bejan A. Shape and structure, from engineering to nature[M]. Cambridge: Cambridge University Press, 2000 [4] Pence D V. Improved thermal efficiency and temperature uniformity using fractal-Like branching channel networks International Conference on Heat Transfer and Transport Phenomena in Microscale. Begell House, New York: , 2000: 142-148 [5] Murray C D. The physiological principle of minumum work, in the vascular system and the cost of blood-volume Proc Natl Acad Sci. USA: , 1926:207-214 [6] Pence D V. Reduced pumping power and wall temperature in microchannel heat sinks with fractal-Like branching channel Networks[J]. Microscale Thermophys Eng, 2002, 6(4):319-330 [7] Wang Xiangqi, Mujumdar A S, Yap C. Numerical analysis of blockage and optimization of heat transfer performance of fractal-like microchannel nets[J]. Journal of Electronic Packaging,2006, 128(3):38-45

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