Numerical analysis of flow and heat transfer characteristics of Y-fractal-link micro channel networks
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摘要: 针对矩形芯片提出了Y形构形微通道的芯片内部冷却结构,通过三维数值计算比较了Y形构形微通道与传统直微通道中的流体层流流动和换热特性,并对Y形构形微通道的重要结构参数进行了优化.研究表明:在相同对流换热面积和水利直径的条件下,Y形构形微通道具有比直微通道更高的传热效率和更低的进出口压降,可以满足高热负荷需求.在研究范围内通道级数为3级、分叉角度为60°、分支个数为2时,散热器的综合换热性能最好.以上结论为Y形构形微通道的结构设计提供了重要依据.Abstract: A new fractal structure, Y-fractal-link micro channel network, was proposed for cooling the inside of cubic chip. Numerical simulations of laminar heat and flow transfer were conducted for both Y-fractal-link micro channel network and straight parallel micro channel network. In addition, the optimization of this new structure was discussed with some important parameters. Results reveal that with the same convective surface area and hydraulic diameter, Y-fractal-link micro channel network could significantly improve the heat transfer performance of the heat sink and decrease the pressure drop through the micro channel, so this new structure will be useful for cooling devices with high thermal load. In the range of study, the best integrative performance of Y-fractal-link micro channel heat sink is obtained when the number of branching levels is 3; the bifurcation angle is 60 and the number of branches at each level is 2. These results are beneficial to the design and improvement of heat sink configuration.
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Key words:
- micro channel /
- heat sink /
- fractal /
- enhancement heat transfer
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