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摘要:
碳纤维增强环氧树脂基体（C/E）复合材料具有优异的性能，广泛用于制造飞行器结构件。在加工C/E复合材料连接孔过程中容易出现分层、撕裂等加工缺陷，而切削温度过高是导致加工缺陷的主要原因之一。螺旋铣孔作为新的制孔技术，加工C/E复合材料时表现出许多优于传统钻孔的特点，受到广泛关注。本文采用专用加工装备开展了C/E复合材料制孔试验，利用红外热像仪实时监测切削温度，分析了螺旋铣孔加工参数对切削温度的影响规律。根据螺旋铣孔运动学规律和切削原理，从未变形切屑形状特点入手分析了螺旋铣孔切削温度的来源和影响因素。研究结果可对深入理解螺旋铣孔加工机理、制定合理的螺旋铣孔加工工艺提供依据。
Abstract:Carbon/epoxy (C/E) composites are widely used in manufacture of aircraft structural components because of its excellent properties. It is easy to delaminate and tear when processing C/E composites, and the high cutting temperature is the main cause of defects. As a new hole-machining method, helical milling attracted plenty of attention owning to its advantages in processing C/E composites compared with traditional drilling. The helical milling experiments were performed with specially designed helical milling equipment on C/E composite. A thermal infrared imager is used to measure the cutting temperature after precision calibration using a thermocouple in a constant temperature oven. The effects of the processing parameters on the cutting temperature are analyzed. According to the kinematic principle of helical milling and the cutting principle, the origin and influence factor of temperature are analyzed based on the shape and size of the undeformed chip. The results are helpful in understanding the machining mechanism of helical milling, and determining the reasonable processing parameters of helical milling.
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Key words:
- helical milling /
- C/E composites /
- cutting temperature /
- undeformed chip /
- hole-machining
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图 5 自转转速、公转转速及进给速度对切削温度的影响
Figure 5. Effect of spindle speed, orbital speed and feed speed on cutting temperature
图 7 不同自转转速、公转转速及进给速度下未变形切屑表面积
Figure 7. Undeformed chip area under different spindle speeds, orbital speeds and feed speeds
表 1 螺旋铣孔加工参数
Table 1. Processing parameters of helical milling
加工参数 n/(r·min-1) np/(r·min-1) fa/(mm·min-1) 自转转速 3 000, 5 000, 7 000, 9 000, 11 000 60 10 公转转速 5 000 30，40，50，60 10 进给速度 5 000 30 6，8，10，12，14 
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表 2 温度标定结果
Table 2. Results of temperature calibration
热烘箱温度/℃ 150 175 200 225 250 热电偶测温/℃ 153.8 182.1 208.0 233.1 260.4 红外热像仪测温/℃ 157.7 182.1 206.8 230.2 254.6 热电偶及红外热像仪测温相对误差/% 2.6 0 0.6 1.2 2.2
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