Metal structure crack monitoring based on copper film sensor in corrosion environment
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摘要:
铜薄膜传感器在飞机金属结构损伤监测过程中,将长期面临大气腐蚀环境的影响。针对此背景,研究了铜薄膜传感器在腐蚀环境下的耐蚀性能,及腐蚀后的疲劳裂纹监测性能。首先,采用脉冲偏压多弧离子镀技术在不同弧电流和基体负偏压水平下制备了一系列铜薄膜,对其耐蚀性能进行了对比研究。结果表明,在弧电流60 A和基体负偏压250 V时沉积的铜薄膜耐蚀性能最佳。然后,结合耐蚀性能最佳的沉积工艺参数,在2A12-T4铝合金中心孔板试件上制备了同心环状铜薄膜传感器阵列,并开展了盐雾腐蚀试验。最后,对腐蚀试验后的铜薄膜传感器进行了疲劳裂纹监测试验。结果表明:铜薄膜传感器在腐蚀环境下具有良好的耐蚀性能,耐蚀时间达1 000 h;腐蚀试验后的铜薄膜传感器对裂纹变化敏感,能实现对裂纹定量监测,监测精度为1 mm,监测结果具有良好的可重复性。
Abstract:In the process of monitoring aircraft metal structure crack, copper film sensor is exposed to atmospheric corrosion environment. The corrosion resistance of copper film sensor and crack monitoring performance after corrosion experiment were researched under the background. First, copper films were deposited by pulsed bias arc ion plating technique at difference levels of current and negative substrate bias. The corrosion resistance was researched. The result shows that the optimal corrosion resistance of copper film was deposited at level of current 60 A and negative substrate bias 250 V. Then, a concentric ring copper film sensor array was deposited on 2A12-T4 aluminum alloy using the optimal depositing parameter. A salt-spray environment experiment was carried out. Finally, a fatigue crack monitoring experiment was carried out using the copper film sensor which was exposed in corrosion environment. The results show that the copper film sensor has good corrosion resistance. The corrosion resistance time reaches 1 000 h. The copper film sensor is very sensitive to fatigue crack and can realize quantitative monitoring with the accuracy of 1 mm. Besides, the monitoring results are repeatable.
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Key words:
- structure health monitoring /
- copper film sensor /
- corrosion resistance /
- crack /
- metal structure
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表 1 铜薄膜沉积工艺参数
Table 1. Copper film deposition process parameters
参数 数值 基体负偏压/V 依据设计参数 氩气气压/Pa 2.2~2.4 沉积时间/min 12~15 弧电流/A 依据设计参数 表 2 盐雾腐蚀试验条件
Table 2. Salt-spray corrosion test condition
参数 数值 盐雾沉积速度/(mL·h-1·80 cm-2) 1~2 NaCl溶液浓度/(g·L-1) 50±5 喷雾气源压力/Pa 100~140 相对湿度/% ≥90 温度/℃ 40±2 pH 4±0.2 腐蚀率范围 腐蚀评级 无腐蚀 10 0 < A≤0.1 9 0.1 < A≤0.25 8 0.25 < A≤0.5 7 0.5 < A≤1.0 6 1.0 < A≤2.5 5 2.5 < A≤5.0 4 5.0 < A≤10 3 10 < A≤25 2 25 < A≤50 1 50 < A 0 外观评级 试样表面外观的变化 A 无变化 B 轻微到中度的变色 C 严重变色到极轻微的失光 D 轻微的失光或出现极轻微的腐蚀产物 E 严重的失光,或在试样局部表面上布有薄层的腐蚀产物或点蚀 F 有腐蚀物或点蚀,且其中之一集中斑布在整个试样表面上 G 整个表面上布有厚的腐蚀产物层或点蚀,并有深的点蚀 H 整个表面上布有非常厚的腐蚀产物或点蚀,并有深的点蚀 表 5 第1组铜薄膜试件盐雾腐蚀试验结果
Table 5. Results of the first group copper filmafter salt-spray corrosion test
参数组合(弧电流,A/基体负偏压,V) 腐蚀等级(腐蚀评级/外观评级) 腐蚀12 h 腐蚀24 h 腐蚀36 h 腐蚀48 h 40/100 10/C 5/E 2/F 50/100 10/C 5/E 2/F 60/100 10/C 5/E 2/F 70/100 10/A 4/D 3/E 2/F 80/100 10/B 5/D 3/E 2/F 表 6 第2组铜薄膜试件盐雾腐蚀试验结果
Table 6. Results of the second group copper film after salt-spray corrosion test
参数组合(弧电流,A/基体负偏压,V) 腐蚀等级(腐蚀评级/外观评级) 腐蚀12 h 腐蚀24 h 腐蚀36 h 腐蚀48 h 腐蚀60 h 腐蚀72 h 腐蚀84 h 60/20 5/D 5/E 2/G 60/60 10/C 5/E 2/G 60/100 10/C 5/E 2/F 60/140 10/B 6/D 5/D 5/D 3/E 3/E 2/F 60/180 10/B 6/D 3/F 2/F 表 7 铜薄膜耐蚀性最佳的沉积工艺参数组合
Table 7. Deposition process parameter combination for optimal corrosion resistance of copper film
参数组合(弧电流,A/基体负偏压,V) 腐蚀等级(腐蚀评级/外观评级) 腐蚀12 h 腐蚀24 h 腐蚀36 h 腐蚀48 h 腐蚀60 h 腐蚀84 h 腐蚀204 h 60/250 10/A 10/A 10/B 10/C 10/D 9/E 9/E 70/150 10/B 5/D 4/D 3/E 2/E 70/200 6/D 6/D 4/D 3/E 2/E 80/100 10/B 5/D 3/E 2/F 表 8 硫酸-硼酸阳极氧化工艺参数
Table 8. Sulfuric acid/boric acid anodic oxidation process parameters
参数 溶液浓度/(g·L-1) 温度/℃ 直流电压/V 时间/min H2SO4 H3B3 Al3+ 数值 40~60 10~15 < 5.5 20~30 15~20 30~40 -
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