金属化丙烯酸酯橡胶微球的制备及其电性能

高达利; 詹茂盛

金属化丙烯酸酯橡胶微球的制备及其电性能

北京航空航天大学材料科学与工程学院, 北京 100191

详细信息

作者简介:
高达利(1980-),男,北京人, 博士生, zhanms@buaa.edu.cn.

中图分类号: TB 34
计量
- 文章访问数: 3489
- HTML全文浏览量: 194
- PDF下载量: 1280
- 被引次数: 0
出版历程
- 收稿日期: 2007-07-24
- 网络出版日期: 2008-08-31

Fabrication and electricity properties of metal covered acrylate rubber microspheres by electroless plating

School of Materials Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100191, China

摘要

摘要: 采用化学镀方法,对微米级丙烯酸酯橡胶(ACM,Acrylate rubbers)微球进行表面金属铜镀覆;通过对镀铜反应进程的控制,制备出了镀层致密、包覆均匀的低密度ACM核-铜壳结构复合导电微球(简称镀铜ACM复合微球);研究了镀铜ACM复合微球表面铜镀层的结构、形貌及微球的电性能.结果表明:应用化学镀的方法可以对ACM微球进行表面金属铜镀覆;通过控制镀液中OH^-的补加量,能够准确控制化学镀铜反应进程及表面镀层包覆程度;不同包覆程度的镀铜ACM复合导电微球的体积电阻率均随外加压力增大而降低,几乎不随通电时间变化,但随温度升高表现出阻-温特性.
- 橡胶微球 /
- 铜镀层 /
- 化学镀 /
- 电阻率
Abstract: Electroless copper plating on acrylate rubber (ACM) microspheres of micron scale was studied. By introducing a reaction control method, the continuously and uniformly covered ACM conductive microspheres with low density and core-shell structure were achieved. The morphology and composition of Cu coatings and the electrical properties of the Cu-coated ACM microspheres were investigated. It was found that Cu can be plated on the surface of ACM microspheres by electroless plating. The reaction process of electroless copper plating can be controlled by adjusting the OH^-additional amounts, thus to control the morphology of Cu coatings. The Cu-coated ACM microspheres all present resistance characters that the volume resistivity declines with pressure, but remains constant with electrifing time. And the Cu-coated ACM microspheres present the special resistance behaviors with the rising of temperature.
- rubber microspheres /
- Cu coatings /
- electroless plating /
- electric resistivity

HTML全文

参考文献(1)

[1] Straffelini G,Colombo D,Molinari A. Surface durability of electroless Ni-P composite deposits[J]. Wear,1999,236(1/2):179-188 [2] Grosjean A,Rezrazi M,Takadoum J,et al. Hardness, friction and wear characteristics of nickel-SiC electroless composite deposits[J]. Surface and Coatings Technology,2001,137(1):92-96 [3] Xu Xinrui,Luo Xiaojun,Zhuang Hanrui,et al. Electroless silver coating on fine copper powder and its effects on oxidation resistance[J]. Materials Letters,2003,57:3987 [4] Ramesh S,Prozorov R,Gedanken A .Ultrasound driven deposition and reactivity of nanophasic amorphous iron clusters with surface silanols of submicrospherical Silica[J]. Chemical Material,1997,12(9):2996-3004 [5] Zhang Haijun,Wu Xiangwei,Jia Quanli,et al. Preparation and microwave properties of Ni-SiC ultrafine powder by electroless plating[J]. Materials and Design,2007,28:1369-1373 [6] Zhang Qiuyu,Wu Min,Zhao Wen. Electroless nickel plating on hollow glass microspheres[J]. Surface and Coatings Technology,2005,192:213-219 [7] Lin Yimao,Yen Shichern．Effects of additives and chelating agents on eletroless copper plating[J]. Applied Surface Science,2001,178:116 [8] 李宁. 化学镀实用技术[M]. 北京:化学工业出版社,2004:248-249 Li Ning. Practical electroless plating techonology[M]. Beijing:Chemical Industry Press,2004:248-249 (in Chinese) [9] Vaskelis A,Norkus E,Stalnioniene I,et a1．Effect of the Cu electrode formation conditions and surface nano-scale roughness on formaldehy-de anodic oxidation[J]．Electrochimica Acta,2004,49:1613 [10] GBT 5161-1985,金属粉末-有效密度的测定-液体浸透法[S] GBT 5161-1985,Metallic powders-determination of effective density-liquid immersion method [S] (in Chinese)

施引文献

资源附件(0)

访问统计