| Citation: | QIN Haichao, YAN Zhaowen, SU Donglin, et al. Electromagnetic susceptibility analysis method for 3D TSV ICs[J]. Journal of Beijing University of Aeronautics and Astronautics, 2017, 43(12): 2406-2415. doi: 10.13700/j.bh.1001-5965.2016.0847(in Chinese)
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This paper focuses on the circuit modeling method of through silicon via (TSV) and power distribution network (PDN) in 3D integrated circuits (3D ICs). Combined with the PDN on printed circuit board (PCB) and the chip PDN model, an electromagnetic susceptibility (EMS) modeling and collaborative analysis method for 3D ICs on PCB was proposed. Firstly, a ground-signal (GS) TSV pair and two TSV pairs of ground-signal1-signal2-ground (GSSG) were established in, and these circuit models were compared with the numerical simulation results, which validated the accuracy of the circuit modeling method of TSV. Then, the modeling method of PDN of PCB, PCB through via hole, IC's package parameters in an IC were discussed. Finally, an EMS cascade connection analysis model from PCB to 3D ICs was developed and used to analyze the electromagnetic susceptibility characteristics of 3D ICs to power interference, which can guide the susceptibility analysis of 3D ICs.
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