| Citation: | QIN Haichao, YAN Zhaowen, SU Donglin, et al. Electromagnetic susceptibility analysis method for 3D TSV ICs[J]. Journal of Beijing University of Aeronautics and Astronautics, 2017, 43(12): 2406-2415. doi: 10.13700/j.bh.1001-5965.2016.0847(in Chinese)
|
This paper focuses on the circuit modeling method of through silicon via (TSV) and power distribution network (PDN) in 3D integrated circuits (3D ICs). Combined with the PDN on printed circuit board (PCB) and the chip PDN model, an electromagnetic susceptibility (EMS) modeling and collaborative analysis method for 3D ICs on PCB was proposed. Firstly, a ground-signal (GS) TSV pair and two TSV pairs of ground-signal1-signal2-ground (GSSG) were established in, and these circuit models were compared with the numerical simulation results, which validated the accuracy of the circuit modeling method of TSV. Then, the modeling method of PDN of PCB, PCB through via hole, IC's package parameters in an IC were discussed. Finally, an EMS cascade connection analysis model from PCB to 3D ICs was developed and used to analyze the electromagnetic susceptibility characteristics of 3D ICs to power interference, which can guide the susceptibility analysis of 3D ICs.
| [1] |
KNICKERBOCKER J U, ANDRY P S, DANG B, et al.3D silicon integration[C]//200858th Electronic Components and Technology Conference.Piscataway, NJ:IEEE Press, 2008:538-543.
|
| [2] |
CADIX L, FARCY A, BERMOND C, et al.Modelling of through silicon via RF performance and impact on signal transmission in 3D integrated circuits[C]//IEEE International Conference on 3D System Integration, 2009.Piscataway, NJ:IEEE Press, 2009:1-7.
|
| [3] |
ZHU Y, MA S, SUN X, et al.Developssment and characterization of a through-multilayer TSV integrated SRAM module[C]//2013 IEEE 63rd Electronic Components and Technology Conference.Piscataway, NJ:IEEE Press, 2013:885-890.
|
| [4] |
KIM J S, OH C S, LEE H, et al.A 1.2V 12.8GB/s 2Gb mobile Wide-I/O DRAM with 4×128 I/Os using TSV-based stacking[C]//2011 IEEE International Solid-State Circuits Conference.Piscataway, NJ:IEEE Press, 2011:496-498.
|
| [5] |
YOON K, KIM G, LEE W, et al.Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer[C]//Electronics Packaging Technology Conference, 2009.Piscataway, NJ:IEEE Press, 2009:702-706.
|
| [6] |
HAN K J, SWAMINATHAN M, JEONG J.Modeling of through-silicon via (TSV) interposer considering depletion capacitance and substrate layer thickness effects[J].IEEE Transactions on Components, Packaging and Manufacturing Technology, 2015, 5(1):108-118. doi: 10.1109/TCPMT.2014.2372771
|
| [7] |
NDIP I, ZOSCHKE K, LBICKE K, et al.Analytical, numerical-, and measurement-based nethods for extracting the electrical parameters of through silicon vias (TSVs)[J].IEEE Transactions on Components, Packaging and Manufacturing Technology, 2014, 4(3):504-515. doi: 10.1109/TCPMT.2013.2279688
|
| [8] |
XU Z, BEECE A, ZHANG D, et al.Characterization and modeling of solder balls and through-strata-vias (TSVs) in 3D architecture[C]//19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems.Piscataway, NJ:IEEE Press, 2010:37-40.
|
| [9] |
CHO J, SHIM J, SONG E, et al.Active circuit to through silicon via (TSV) noise coupling[C]//2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems.Piscataway, NJ:IEEE Press, 2009:97-100.
|
| [10] |
SONG T, LIU C, KIM D, et al.Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs[C]//201112th International Symposium on Quality Electronic Design (ISQED).Piscataway, NJ:IEEE Press, 2011:1-7.
|
| [11] |
XIE B, SWAMINATHAN M, HAN K J, et al.Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems[C]//2011 IEEE International Symposium on Electromagnetic Compatibility (EMC).Piscataway, NJ:IEEE Press, 2011:16-21.
|
| [12] |
CURRAN B, NDIP I, GUTTOVSKI S, et al.The impacts of dimensions and return current path geometry on coupling in single ended through silicon vias[C]//200959th Electronic Components and Technology Conference.Piscataway, NJ:IEEE Press, 2009:1092-1097.
|
| [13] |
CHO J, SONG E, YOON K, et al.Modeling and analysis of through-silicon via (TSV) noise coupling and suppression using a guard ring[J].IEEE Transactions on Components, Packaging and Manufacturing Technology, 2011, 1(2):220-233. doi: 10.1109/TCPMT.2010.2101892
|
| [14] |
XU Z, BEECE A, ZHANG D, et al.Crosstalk evaluation, suppression and modeling in 3D through-strata-via (TSV) network[C]//IEEE International 3D Systems Integration Conference (3DIC).Piscataway, NJ:IEEE Press, 2010:1-8.
|
| [15] |
CHIANG C H, KUO L M, HU Y C, et al.Sealing bump with bottom-up Cu TSV plating fabrication in 3-D integration scheme[J].IEEE Electron Device Letters, 2013, 34(5):671-673. doi: 10.1109/LED.2013.2250249
|
| [1] | YANG Z Y，WU J，LI L T. Dynamic analysis method of single ion channel neuron circuit[J]. Journal of Beijing University of Aeronautics and Astronautics，2025，51（3）：985-991 （in Chinese）. doi: 10.13700/j.bh.1001-5965.2023.0144. |
| [2] | HE X N，LI Y H，YANG J. Optimization model for dual hub airline networks based on competition scenario[J]. Journal of Beijing University of Aeronautics and Astronautics，2024，50（9）：2902-2911 （in Chinese）. doi: 10.13700/j.bh.1001-5965.2022.0709. |
| [3] | JU T，LIU S，WANG Z Q，et al. Task segmentation and parallel optimization of DNN model[J]. Journal of Beijing University of Aeronautics and Astronautics，2024，50（9）：2739-2752 （in Chinese）. doi: 10.13700/j.bh.1001-5965.2022.0731. |
| [4] | LIANG X Z，HUANG Z Y，AI F M，et al. Dynamic model by transfer function and parameter determination method of plate fin heat exchanger[J]. Journal of Beijing University of Aeronautics and Astronautics，2024，50（1）：154-162 （in Chinese）. doi: 10.13700/j.bh.1001-5965.2022.0202. |
| [5] | ZHAO Hong-jia, ZHANG Duo-na, LU Yuan-yao, DING Wen-rui. Intelligent Recognition of Electromagnetic Signal Modulation with Embedded Domain Knowledge[J]. Journal of Beijing University of Aeronautics and Astronautics. doi: 10.13700/j.bh.1001-5965.2023.0746 |
| [6] | PAN Jiayi, HE Zhenxue, ZHAO Xiaojun, HE Juncai, ZHOU Yuhao, WANG Xiang. Area Optimization Approach for MPRM Logic Circuits Based on Multi-strategy Synergy Ant Lion Optimization Algorithm[J]. Journal of Beijing University of Aeronautics and Astronautics. doi: 10.13700/j.bh.1001-5965.2024.0259 |
| [7] | NIU G C，WANG X N. A multi-task traffic scene detection model based on cross-attention[J]. Journal of Beijing University of Aeronautics and Astronautics，2024，50（5）：1491-1499 （in Chinese）. doi: 10.13700/j.bh.1001-5965.2022.0610. |
| [8] | ZHAO W K，WANG L Y，CEN X M，et al. Area optimization of multilevel logic circuits using approximate computing[J]. Journal of Beijing University of Aeronautics and Astronautics，2024，50（9）：2893-2901 （in Chinese）. doi: 10.13700/j.bh.1001-5965.2022.0742. |
| [9] | XU Y，GUO H J，CHAO L D，et al. Design and analysis of ground test control circuit on liquid rocket engine[J]. Journal of Beijing University of Aeronautics and Astronautics，2024，50（7）：2245-2255 （in Chinese）. doi: 10.13700/j.bh.1001-5965.2022.0614. |
| [10] | FAN Haimei, WU Qianhuo, WANG Lunyao. Area approximate optimization of logic circuits based on error rate allocation[J]. Journal of Beijing University of Aeronautics and Astronautics. doi: 10.13700/j.bh.1001-5965.2024.0211 |
| [11] | YUAN Run-jie, CHEN Rui, HAN Jian-wei, XIA Qing, WANG Xuan, CHEN Qian, LIANG Ya-nan. Mechanism of anomalies in operational amplifier induced by proton deep charge-discharge effects[J]. Journal of Beijing University of Aeronautics and Astronautics. doi: 10.13700/j.bh.1001-5965.2024.0060 |
| [12] | YU Zong-yuan, WANG Lun-yao, CHU Zhu-fei, XIA Yin-shui. Area Optimization of Logic Circuits in HDL-Level Using Approximate Computing[J]. Journal of Beijing University of Aeronautics and Astronautics. doi: 10.13700/j.bh.1001-5965.2023.0838 |
| [13] | Zhang Wei, Zhou Lin, Chen Xian, Shu Bowen, Huang Jiangtao, Gao Zhenghong. Sensitivity analysis and optimization design of high stealth flying wing layout airfoil[J]. Journal of Beijing University of Aeronautics and Astronautics. doi: 10.13700/j.bh.1001-5965.2024.0112 |
| [14] | SHAO Y X，HE Z X，ZHOU Y H，et al. Area optimization of MPRM circuits based on M-AFSA[J]. Journal of Beijing University of Aeronautics and Astronautics，2023，49（3）：693-701 （in Chinese）. doi: 10.13700/j.bh.1001-5965.2021.0296. |
| [15] | QIN D G，HE Z X，CHEN C，et al. Area optimization of FPRM logic circuits based on SMABC algorithm[J]. Journal of Beijing University of Aeronautics and Astronautics，2023，49（8）：2099-2107 （in Chinese）. doi: 10.13700/j.bh.1001-5965.2021.0579. |
| [16] | HE J C，HE Z X，WANG F S，et al. Circuit area optimization of multi-output MPRM based on ERWOA algorithm[J]. Journal of Beijing University of Aeronautics and Astronautics，2023，49（5）：1193-1200 （in Chinese）. doi: 10.13700/j.bh.1001-5965.2021.0410. |
| [17] | FU C S，YAN Z W，SU D L. Research on broadband and high flatness conductive electromagnetic susceptibility injection probe[J]. Journal of Beijing University of Aeronautics and Astronautics，2023，49（11）：3000-3009 （in Chinese）. doi: 10.13700/j.bh.1001-5965.2022.0015. |
| [18] | SU Donglin, CUI Shuo, BAI Jiangfei, LI Yaoyao. Fast prediction method for radiated and scattered coupled fields in complex electromagnetic environment[J]. Journal of Beijing University of Aeronautics and Astronautics, 2022, 48(9): 1553-1560. doi: 10.13700/j.bh.1001-5965.2022.0705 |
| [19] | ZHOU Yuhao, HE Zhenxue, LIANG Xinyi, FAN Xinchao, HUO Zhisheng, XIAO Limin. Optimization of XNOR/OR circuit area based on BABFA[J]. Journal of Beijing University of Aeronautics and Astronautics, 2022, 48(10): 2031-2039. doi: 10.13700/j.bh.1001-5965.2021.0056 |
| [20] | DU Mo, MENG Bao, PAN Feng, WAN Min. Optimal design of printed circuit heat exchanger considering manufacturing constraints[J]. Journal of Beijing University of Aeronautics and Astronautics, 2022, 48(10): 1994-2005. doi: 10.13700/j.bh.1001-5965.2021.0045 |
Figures(22) / Tables(4)
Copyright © Journal of Beijing University of Aeronautics and Astronautics
Address: Editorial Department of Journal of Beijing University of Aeronautics and Astronautics, 37 Xueyuan Road, Haidian District, Beijing Post Code: 100191 Email: jbuaa@buaa.edu.cn
Supported by:
Beijing Renhe Information Technology Co., Ltd.
Mei Zhongyi, Fan Yuqing. Flexible assembly technique for aircraft parts joining based on laser tracking and positioning[J]. Journal of Beijing University of Aeronautics and Astronautics, 2009, 35(1): 65-69. (in Chinese)
DownLoad:
